Lenovo: Difference between revisions
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Lenovo uses a strong black underfill material, often referred to as "glue"<ref>{{Cite web |date=2019-03-29 |title=Remove Lenovo black Glue under the chipset? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/68715-remove-lenovo-black-glue-under-the-chipset |url-status=live |access-date=2025-08-31 |website=Badcaps}}</ref> around the corners of some BGA (ball grid array) components. The underfill adds strength and helps protect the chips from physical stress<ref>{{Cite web |title=Underfills |url=https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |url-status=live |access-date=2025-08-31 |website=Henkel |archive-url=http://web.archive.org/web/20250803185652/https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |archive-date=3 Aug 2025}}</ref>. | Lenovo uses a strong black underfill material, often referred to as "glue"<ref>{{Cite web |date=2019-03-29 |title=Remove Lenovo black Glue under the chipset? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/68715-remove-lenovo-black-glue-under-the-chipset |url-status=live |access-date=2025-08-31 |website=Badcaps}}</ref> around the corners of some BGA (ball grid array) components. The underfill adds strength and helps protect the chips from physical stress<ref>{{Cite web |title=Underfills |url=https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |url-status=live |access-date=2025-08-31 |website=Henkel |archive-url=http://web.archive.org/web/20250803185652/https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |archive-date=3 Aug 2025}}</ref>. | ||
Users have noted, however, that the material is very difficult to remove. In some cases, attempts to take out these components can result in the pads being ripped from the board, making repairs more challenging.<ref>{{Cite web |date=2023-11-16 |title=how to remove black glue in edges of chips in Lenovo laptops? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |url-status=live |access-date=2025-08-31 |website=Badcaps}}</ref> | Users have noted, however, that the material is very difficult to remove. In some cases, attempts to take out these components can result in the pads being ripped from the board, making repairs more challenging.<ref>{{Cite web |date=2023-11-16 |title=how to remove black glue in edges of chips in Lenovo laptops? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |url-status=live |access-date=2025-08-31 |website=Badcaps |archive-url=http://web.archive.org/web/20250326202959/https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |archive-date=26 Mar 2025}}</ref> | ||
[[File:Lenovo underfill.jpg|none|thumb|354x354px|Example of the black underfill being used on a Lenovo ThinkPad laptop]] | [[File:Lenovo underfill.jpg|none|thumb|354x354px|Example of the black underfill being used on a Lenovo ThinkPad laptop]] | ||
==References== | ==References== | ||
<references /> | <references /> | ||
[[Category:Lenovo]] | [[Category:Lenovo]] | ||