Bumpgate: Difference between revisions

[[File:Underfilled Die.png|alt=The image shows a diagram of a computer processor. On the bottom, there is a green rectangle labeled "substrate". On top of the substrate, there is a black rectangle labeled "chip", which refers to the die. Between the die and the substrate, there are small silver bumps equally spaced apart, encased within a white "filling". The bumps are the solder bumps connecting the die to the substrate, and the white filling is the underfill- meant to strengthen the solder bumps.|thumb|A diagram of a computer processor. When the underfill becomes too soft at any point in the processor's normal operating temperatures, the solder bumps under the die ("chip") can crack, disconnecting the die from the substrate. This leads to the processor failing, and in turn, leads to a critical system failure for the device it's in.]]

'''Bumpgate''' (also known as '''Nvidiagate''') was a scandal where [[Nvidia]] and ATI Graphics Processing Units (GPUs) made from 2005-2010 were prone to high failure rates because of a design flaw that caused cracked solder bumps under the die.<ref name=":0" />