Editing Bumpgate

'''Bumpgate''', also known as '''Nvidiagate''', was a scandal where [[Nvidia]] and ATI Graphics Processing Units (GPUs) were prone to high failure rates due to a design flaw that led to cracked solder bumps under the die. Despite the "Nvidiagate" name, this defect not only affected many Nvidia GPUs made from approximately 2006 to 2010, but it also affected ATI GPUs from 2005 to 2008. Among retro console enthusiasts, the defect is best known to have likely been the culprit behind the high failure rate of Nvidia GPUs in [[Sony]]'s early PlayStation 3 models and ATI GPUs in [[Microsoft]]'s early Xbox 360 models.

==Background==

=== Nvidia GPU Fault ===
In 2006, GPU manufacturer Nvidia developed some GPUs that had a serious design flaw. The company had engineered GPUs that electrically connected the silicon chip (die) to the substrate using high lead solder bumps. It's standard to use an epoxy-like substance called underfill to give these solder bumps a bit more strength, especially when the processor gets warm.

At the time, it was more common for GPU manufacturers to use eutectic solder bumps, but high-lead solder bumps were more suitable for the power delivery that these new GPUs needed<ref>{{Cite web |last=Williams |first=Rob |date=29 Sep 2008 |title=NVIDIA at a Disadvantage Due to their Choice of Solder? |url=https://techgage.com/news/nvidia_at_a_disadvantage_due_to_their_choice_of_solder/ |url-status=live |access-date=1 Jun 2025 |website=Techgage}}</ref>. However, because the high-lead solder balls had a lower melting point than eutectic solder balls, Nvidia's engineers had to use an underfill that was just the right hardness.

However, at the time, there was no underfill that fit the exact specifications that Nvidia's GPUs needed. The underfill that Nvidia used on these defective GPUs was too soft. This meant that when the processor went through thermal changes, the solder balls would soften under heat and harden as they cooled.<ref>{{Cite web |last=Demerjian |first=Charlie |date=1 Sep 2008 |title=Why Nvidia's chips are defective |url=http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |url-status=dead |archive-url=https://web.archive.org/web/20090520152257/http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |archive-date=20 May 2009 |access-date=1 Jun 2025 |website=The Inquirer}}</ref> This would happen over and over again until they cracked under the thermal stress. When enough solder balls cracked, it would cause a failure in the unit.

==[Incident]==
{{Placeholder box|Change this section's title to be descriptive of the incident.

Impartial and complete description of the events, including actions taken by the company, and the timeline of the incident coming to the public's attention.}}

===[Company]'s response===
{{Placeholder box|If applicable, add the proposed solution to the issues by the company.}}


==Lawsuit==
{{Placeholder box|If applicable, add any information regarding litigation around the incident here.

===Claims===
Main claims of the suit.

===Rebuttal===
The response of the company or counterclaims.

===Outcome===
The outcome of the suit, if any.}}


==Consumer response==
{{Placeholder box|Summary and key issues of prevailing sentiment from the consumers and commentators that can be documented via articles, emails to support, reviews and forum posts.}}


==References==
{{reflist}}

{{Placeholder box|[[mw:Help:VisualEditor/User_guide#Editing_categories|Add a category]] with the same name as the product, service, website, software, product line or company that this article is about.

The "Incidents" category is not needed.}}