Bumpgate: Difference between revisions
Intro: Clarified that the defect affected ATI as well, hence why it seemingly affected early Xbox 360s. Background: Added simple description of the Nvidia GPUs' fault. (Need to do more research on ATI's fault before adding.) Also has sources now! |
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==Background== | ==Background== | ||
=== Nvidia GPU Fault === | ===Nvidia GPU Fault=== | ||
In 2006, GPU manufacturer Nvidia developed some GPUs that had a serious design flaw. The company had engineered GPUs that electrically connected the silicon chip (die) to the substrate using high lead solder bumps. It's standard to use an epoxy-like substance called underfill to give these solder bumps a bit more strength, especially when the processor gets warm. | In 2006, GPU manufacturer Nvidia developed some GPUs that had a serious design flaw. The company had engineered GPUs that electrically connected the silicon chip (die) to the substrate using high lead solder bumps. It's standard to use an epoxy-like substance called underfill to give these solder bumps a bit more strength, especially when the processor gets warm. | ||
At the time, it was more common for GPU manufacturers to use eutectic solder bumps, but high-lead solder bumps were more suitable for the power delivery that these new GPUs needed<ref>{{Cite web |last=Williams |first=Rob |date=29 Sep 2008 |title=NVIDIA at a Disadvantage Due to their Choice of Solder? |url=https://techgage.com/news/nvidia_at_a_disadvantage_due_to_their_choice_of_solder/ |url-status=live |access-date=1 Jun 2025 |website=Techgage}}</ref> | At the time, it was more common for GPU manufacturers to use eutectic solder bumps, but high-lead solder bumps were more suitable for the power delivery that these new GPUs needed.<ref>{{Cite web |last=Williams |first=Rob |date=29 Sep 2008 |title=NVIDIA at a Disadvantage Due to their Choice of Solder? |url=https://techgage.com/news/nvidia_at_a_disadvantage_due_to_their_choice_of_solder/ |url-status=live |access-date=1 Jun 2025 |website=Techgage}}</ref> However, because the high-lead solder balls had a lower melting point than eutectic solder balls, Nvidia's engineers had to use an underfill that was just the right hardness. | ||
However, at the time, there was no underfill that fit the exact specifications that Nvidia's GPUs needed. The underfill that Nvidia used on these defective GPUs was too soft. This meant that when the processor went through thermal changes, the solder balls would soften under heat and harden as they cooled.<ref>{{Cite web |last=Demerjian |first=Charlie |date=1 Sep 2008 |title=Why Nvidia's chips are defective |url=http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |url-status=dead |archive-url=https://web.archive.org/web/20090520152257/http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |archive-date=20 May 2009 |access-date=1 Jun 2025 |website=The Inquirer}}</ref> This would happen over and over again until they cracked under the thermal stress. When enough solder balls cracked, it would cause a failure in the unit. | However, at the time, there was no underfill that fit the exact specifications that Nvidia's GPUs needed. The underfill that Nvidia used on these defective GPUs was too soft. This meant that when the processor went through thermal changes, the solder balls would soften under heat and harden as they cooled.<ref>{{Cite web |last=Demerjian |first=Charlie |date=1 Sep 2008 |title=Why Nvidia's chips are defective |url=http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |url-status=dead |archive-url=https://web.archive.org/web/20090520152257/http://www.theinquirer.net/inquirer/news/1004378/why-nvidia-chips-defective |archive-date=20 May 2009 |access-date=1 Jun 2025 |website=The Inquirer}}</ref> This would happen over and over again until they cracked under the thermal stress. When enough solder balls cracked, it would cause a failure in the unit. | ||