Bumpgate: Difference between revisions

[[File:Underfilled Die.png|alt=The image shows a diagram of a computer processor. On the bottom, there is a green rectangle labeled "substrate". On top of the substrate, there is a black rectangle labeled "chip", which refers to the die. Between the die and the substrate, there are small silver bumps equally spaced apart, encased within a white "filling". The bumps are the solder bumps connecting the die to the substrate, and the white filling is the underfill- meant to strengthen the solder bumps.|thumb|A diagram of a computer processor. When the underfill becomes too soft at any point in the processor's normal operating temperatures, the solder bumps under the die ("chip") can crack, disconnecting the die from the substrate. This leads to the processor failing, and in turn, leads to a critical system failure for the device it's in.]]

==Background==

[[File:GPU early.jpg|alt=An image of a 90 nanometer graphics processing unit from a Microsoft Xbox 360. The die is in the center of the green square, and the eDRAM is located to the left of it. The die has dark greenish low Tg underfill under it, indicating that it is defective.|thumb|200x200px|A ''defective'' 90nm "Xenos" GPU from an '''early''' Xbox 360 (Xenon revision). Note the large die in the center of the chip, and the dark greenish underfill. The color of the underfill is one way to tell if the chip has the low T_g underfill.]]<blockquote>''"The breakthrough came when we understood that the connections that were being broken were not located on the motherboard, but they were actually located inside the components."''

[[File:GPU late.jpg|alt=An image of a 65 nanometer graphics processing unit from a Microsoft Xbox 360. The die is in the center of the green square, and the eDRAM is located to the left of it. The die has a light, whitish underfill- indicating that it is not one of the defective units.|thumb|204x204px|A ''non-defective'' 65nm "Xenos" GPU from a later revision of Xbox 360 (Jasper V2 on "Kronos 1" package). Note the smaller die and the light, whitish underfill.]]

For several months, Microsoft had consumers pay to repair their consoles. However, in 2007, they chose to extend the warranty for Xbox 360 consoles displaying an E74 error (an on-screen error also associated with "Red Ring of Death") from one year from date of purchase, to three years from date of purchase. This allowed most consumers who had consoles with the issue to get their consoles refurbished. In addition, they refunded any consumers who had paid to have their afflicted systems repaired.<ref>{{Cite web |last=Moore |first=Peter |date=2007 |title=Open Letter From Peter Moore |url=http://xbox.com/en-ca/support/petermooreletter.htm |url-status=dead |archive-url=https://web.archive.org/web/20071023004948/http://xbox.com/en-ca/support/petermooreletter.htm |archive-date=23 Oct 2007 |access-date=4 Jun 2025 |website=Xbox}}</ref>

====Sony's Response - The "Yellow Light of Death"====

Instead of admitting that there was a defect and issuing an extended warranty to consumers (like Microsoft did) Sony simply quietly fixed the defect around the same time that Microsoft did for the Xbox 360, so PS3 "slim" revisions and newer were not affected. Specifically, it was only 90nm GPUs that appeared to have low T_g underfill- and hence, the defect.

====Dell's and HP's Responses - BIOS Updates and Free Repairs====

==Consumer response==

===Xbox 360/Microsoft Consumer response===

===PlayStation 3/Sony Consumer Response===

===Nvidia Consumer Response===

===Misdiagnosis/Poor Repair of Faults===

There was a lot of speculation among affected consumers as to why so many GPUs were failing, and theories tended to vary between communities for devices. For example, consumers who purchased an Xbox 360 from this era<ref>{{Cite web |last=Enever |first=Liam |date=1 Oct 2017 |title=Why has my got the red ring of death (sic) |url=https://www.ifixit.com/Answers/View/430460/Why+has+my+got+the+red+ring+of+death |url-status=live |access-date=4 Jun 2025 |website=iFixIt Answers Forum}}</ref> and even some independent repair technicians<ref>{{Cite web |date=8 Apr 2014 |title=Xbox 360 Red Ring of Death: Why Lead-Free Solder or Solder Failure Are the Problem |url=https://electronicfix.com.au/console-repairs/what-does-the-rrod-mean/ |url-status=live |access-date=4 Jun 2025 |website=The Electronic Fix}}</ref> assumed that the issue was caused by Microsoft using lead-free solder balls- used to connect the Xenos GPU to the motherboard- in order to meet new-at-the-time RoHS standards in the European Union. Many blamed it on the more brittle nature of non-leaded solder balls compared to traditional leaded ones. Others thought it was related to the solder balls' melting point, and that the console getting too hot and literally "desoldering" the GPU. These misconceptions largely faded into obscurity when Microsoft released the Jasper and Falcon revisions of the Xbox 360, and announced their extended warranty on their defective consoles. They were dispelled entirely with the release of Chapter 5 of ''Power On: The Story of Xbox''<ref name=":3" />, where hardware engineers for Xbox during this era explained the problem.

A common bad practice between both the Xbox 360 and the PS3 was to reflow the entire motherboard. Even alleged professional repair technicians did this, as shown in BBC's Watchdog segment for the "Yellow Light of Death".<ref name=":1" /> However, because this fault was caused by a defect in the GPU, this would only fix the problem ''temporarily'', if at all. In addition, a motherboard is not designed to go through this process more than once (specifically, at the time of manufacture), so this would damage the motherboard over time until it would be impossible to fix the system again.