Lenovo: Difference between revisions
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==='''AB 1043: Age verification signals''' '''- California Bill'''=== | ==='''AB 1043: Age verification signals''' '''- California Bill'''=== | ||
Assembly Bill 1043, known as the Digital Age Assurance Act, was supported by several technology companies, including '''Lenovo, Inc.''', which formally expressed support for the legislation on 10 September 2025. The bill establishes a framework requiring operating system providers and app stores to implement an age-verification signal during device or account setup.<ref>{{Cite web |date=2025-10-13 |title=AB 1043: Age verification signals: software applications and online services |url=https://calmatters.digitaldemocracy.org/bills/ca_202520260ab1043 |access-date=2026-03-10 |website=almatters.digitaldemocracy.org}}</ref> | Assembly Bill 1043, known as the Digital Age Assurance Act, was supported by several technology companies, including '''Lenovo, Inc.''', which formally expressed support for the legislation on 10 September 2025. The bill establishes a framework requiring operating system providers and app stores to implement an age-verification signal during device or account setup.<ref>{{Cite web |date=2025-10-13 |title=AB 1043: Age verification signals: software applications and online services |url=https://calmatters.digitaldemocracy.org/bills/ca_202520260ab1043 |url-status=live |archive-url=https://web.archive.org/web/20260314121357/https://calmatters.digitaldemocracy.org/bills/ca_202520260ab1043 |archive-date=14 Mar 2026 |access-date=2026-03-10 |website=almatters.digitaldemocracy.org}}</ref> | ||
===Suppliers accused of child labor=== | ===Suppliers accused of child labor=== | ||
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===Black underfill around BGA components=== | ===Black underfill around BGA components=== | ||
'''Lenovo''' uses a strong black underfill material, often referred to as "glue"<ref>{{Cite web |date=2019-03-29 |title=Remove Lenovo black Glue under the chipset? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/68715-remove-lenovo-black-glue-under-the-chipset |url-status=live |access-date=2025-08-31 |website=Badcaps}}</ref> around the corners of some {{Wplink|ball grid array}} (BGA) components. The underfill adds strength and helps protect the chips from physical stress<ref>{{Cite web |title=Underfills |url=https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |url-status=live |access-date=2025-08-31 |website=Henkel |archive-url=http://web.archive.org/web/20250803185652/https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |archive-date=3 Aug 2025}}</ref>. | '''Lenovo''' uses a strong black underfill material, often referred to as "glue"<ref>{{Cite web |date=2019-03-29 |title=Remove Lenovo black Glue under the chipset? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/68715-remove-lenovo-black-glue-under-the-chipset |url-status=live |archive-url=https://web.archive.org/web/20260405163041/https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/68715-remove-lenovo-black-glue-under-the-chipset |archive-date=5 Apr 2026 |access-date=2025-08-31 |website=Badcaps}}</ref> around the corners of some {{Wplink|ball grid array}} (BGA) components. The underfill adds strength and helps protect the chips from physical stress<ref>{{Cite web |title=Underfills |url=https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |url-status=live |access-date=2025-08-31 |website=Henkel |archive-url=http://web.archive.org/web/20250803185652/https://www.henkel-adhesives.com/ch/en/products/encapsulants/underfills.html |archive-date=3 Aug 2025}}</ref>. | ||
Users have noted, however, that the material is very difficult to remove. In some cases, attempts to take out these components can result in the pads being ripped from the board, making repairs more challenging.<ref>{{Cite web |date=2023-11-16 |title=how to remove black glue in edges of chips in Lenovo laptops? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |url-status=live |access-date=2025-08-31 |website=Badcaps |archive-url=http://web.archive.org/web/20250326202959/https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |archive-date=26 Mar 2025}}</ref> | Users have noted, however, that the material is very difficult to remove. In some cases, attempts to take out these components can result in the pads being ripped from the board, making repairs more challenging.<ref>{{Cite web |date=2023-11-16 |title=how to remove black glue in edges of chips in Lenovo laptops? |url=https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |url-status=live |access-date=2025-08-31 |website=Badcaps |archive-url=http://web.archive.org/web/20250326202959/https://www.badcaps.net/forum/troubleshooting-hardware-devices-and-electronics-theory/troubleshooting-laptops-tablets-and-mobile-devices/110425-how-to-remove-black-glue-in-edges-of-chips-in-lenovo-laptops |archive-date=26 Mar 2025}}</ref> | ||
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==See also== | ==See also== | ||
* [[Dell]] | *[[Dell]] | ||
* [[HP]] | *[[HP]] | ||
==References== | ==References== | ||
<references /> | <references /> | ||
[[Category:Lenovo]] | [[Category:Lenovo]] | ||